BAKU, Azerbaijan, October 17. Uzbekistan and
Malaysia have signed memorandums of understanding to develop
semiconductor industry skills, expand technology research and
strengthen cooperation between universities and industry, during a
meeting on October 16 in Malaysia.
This was reflected in the statement by the Uzbekistan Ministry
of Economy and Finance.
The first phase of the visit took place in Kuala Lumpur, where
the delegation visited Malaysia’s IC Design Park complex and MIMOS
Berhad, a key technology research partner in the semiconductor
sector.
The delegation toured MIMOS Berhad’s laboratories and examined
its technological infrastructure for semiconductor wafer
production, microelectronic device prototyping, integrated circuit
testing and reliability assessment.
The Uzbek officials also attended the Selangor AI &
Semiconductor Summit 2026, where they held meetings with
organizations operating in the semiconductor and artificial
intelligence sectors to discuss potential areas for
cooperation.
As part of the visit, ToshTech Technical University signed MoUs
with Malaysia’s ASEM Academy and Great ASIC. Uzbekistan’s Cyber
University also signed agreements with Asia e University (AeU),
Asia Pacific University of Technology & Innovation (APU) and
AlphaSwift.
The agreements are intended to support the training of qualified
semiconductor specialists, advance research and practical projects,
facilitate the exchange of expertise in advanced technologies and
strengthen links between higher education institutions and
industry.
The second phase of the Uzbek delegation’s visit is underway in
Penang, another key stop in efforts to expand cooperation with
Malaysia’s technology sector.
